(module DFN-S-8-1EP_6x5mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77)
  (descr "8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "DFN 1.27")
  (attr smd)
  (fp_text reference REF** (at 0 -3.575) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value DFN-S-8-1EP_6x5mm_Pitch1.27mm (at 0 3.575) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -3.6 -2.85) (end -3.6 2.85) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.6 -2.85) (end 3.6 2.85) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.6 -2.85) (end 3.6 -2.85) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.6 2.85) (end 3.6 2.85) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.25 2.65) (end 2.25 2.65) (layer F.SilkS) (width 0.15))
  (fp_line (start -3.425 -2.65) (end 2.25 -2.65) (layer F.SilkS) (width 0.15))
  (pad 1 smd oval (at -2.8 -1.905) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd oval (at -2.8 -0.635) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd oval (at -2.8 0.635) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd oval (at -2.8 1.905) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd oval (at 2.8 1.905) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd oval (at 2.8 0.635) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd oval (at 2.8 -0.635) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd oval (at 2.8 -1.905) (size 1.1 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0.6 1.5375) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at 0.6 0.512499) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at 0.6 -0.5125) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at 0.6 -1.5375) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.6 1.5375) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.6 0.512499) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.6 -0.5125) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.6 -1.5375) (size 1.2 1.025) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/DFN-S-8-1EP_6x5mm_Pitch1.27mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
