(module DFN-6-1EP_2x2mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77)
  (descr "6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "DFN 0.65")
  (attr smd)
  (fp_text reference REF** (at 0 -2.025) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value DFN-6-1EP_2x2mm_Pitch0.65mm (at 0 2.025) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -1.65 -1.25) (end -1.65 1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.65 -1.25) (end 1.65 1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.65 -1.25) (end 1.65 -1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.65 1.25) (end 1.65 1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start -0.725 1.1) (end 0.725 1.1) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.45 -1.1) (end 0.725 -1.1) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -1.05 -0.65) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.05 0) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.05 0.65) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at 1.05 0.65) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 1.05 0) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 1.05 -0.65) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 0 0.4) (size 1 0.8) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 7 smd rect (at 0 -0.4) (size 1 0.8) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/DFN-6-1EP_2x2mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
