(module QFN-40-1EP_5x5mm_Pitch0.4mm (layer F.Cu) (tedit 54130A77)
  (descr "40-Lead Plastic Quad Flat, No Lead Package (MP) - 5x5 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.4")
  (attr smd)
  (fp_text reference REF** (at 0 -3.875) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value QFN-40-1EP_5x5mm_Pitch0.4mm (at 0 3.875) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -3.15 -3.15) (end -3.15 3.15) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.15 -3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.15 -3.15) (end 3.15 -3.15) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.15 3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.675 -2.675) (end 2.675 -2.125) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.675 2.675) (end -2.675 2.125) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.675 2.675) (end 2.675 2.125) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.675 -2.675) (end -2.125 -2.675) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.675 2.675) (end -2.125 2.675) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.675 2.675) (end 2.125 2.675) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.675 -2.675) (end 2.125 -2.675) (layer F.SilkS) (width 0.15))
  (pad 1 smd oval (at -2.45 -1.8) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd oval (at -2.45 -1.4) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd oval (at -2.45 -1) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd oval (at -2.45 -0.6) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd oval (at -2.45 -0.2) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd oval (at -2.45 0.2) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd oval (at -2.45 0.6) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd oval (at -2.45 1) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd oval (at -2.45 1.4) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd oval (at -2.45 1.8) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd oval (at -1.8 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd oval (at -1.4 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd oval (at -1 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd oval (at -0.6 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd oval (at -0.2 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd oval (at 0.2 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd oval (at 0.6 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd oval (at 1 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd oval (at 1.4 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd oval (at 1.8 2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 21 smd oval (at 2.45 1.8) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 22 smd oval (at 2.45 1.4) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 23 smd oval (at 2.45 1) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 24 smd oval (at 2.45 0.6) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 25 smd oval (at 2.45 0.2) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 26 smd oval (at 2.45 -0.2) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 27 smd oval (at 2.45 -0.6) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 28 smd oval (at 2.45 -1) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 29 smd oval (at 2.45 -1.4) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 30 smd oval (at 2.45 -1.8) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 31 smd oval (at 1.8 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 32 smd oval (at 1.4 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 33 smd oval (at 1 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 34 smd oval (at 0.6 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 35 smd oval (at 0.2 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 36 smd oval (at -0.2 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 37 smd oval (at -0.6 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 38 smd oval (at -1 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 39 smd oval (at -1.4 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 40 smd oval (at -1.8 -2.45 90) (size 0.85 0.2) (layers F.Cu F.Paste F.Mask))
  (pad 41 smd rect (at 0.9 0.9) (size 1.8 1.8) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 41 smd rect (at 0.9 -0.9) (size 1.8 1.8) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 41 smd rect (at -0.9 0.9) (size 1.8 1.8) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 41 smd rect (at -0.9 -0.9) (size 1.8 1.8) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/QFN-40-1EP_5x5mm_Pitch0.4mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
