(module UQFN-16-1EP_4x4mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77)
  (descr "16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.65")
  (attr smd)
  (fp_text reference REF** (at 0 -3.4) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value UQFN-16-1EP_4x4mm_Pitch0.65mm (at 0 3.4) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2.65 -2.65) (end -2.65 2.65) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.65 -2.65) (end 2.65 2.65) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.65 -2.65) (end 2.65 -2.65) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.65 2.65) (end 2.65 2.65) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.175 -2.175) (end 2.175 -1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.175 2.175) (end -2.175 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.175 2.175) (end 2.175 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.175 -2.175) (end -1.375 -2.175) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.175 2.175) (end -1.375 2.175) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.175 2.175) (end 1.375 2.175) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.175 -2.175) (end 1.375 -2.175) (layer F.SilkS) (width 0.15))
  (pad 1 smd oval (at -2 -0.975) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd oval (at -2 -0.325) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd oval (at -2 0.325) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd oval (at -2 0.975) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd oval (at -0.975 2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd oval (at -0.325 2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd oval (at 0.325 2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd oval (at 0.975 2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd oval (at 2 0.975) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd oval (at 2 0.325) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd oval (at 2 -0.325) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd oval (at 2 -0.975) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd oval (at 0.975 -2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd oval (at 0.325 -2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd oval (at -0.325 -2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd oval (at -0.975 -2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 0.675 0.675) (size 1.35 1.35) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at 0.675 -0.675) (size 1.35 1.35) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at -0.675 0.675) (size 1.35 1.35) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at -0.675 -0.675) (size 1.35 1.35) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/UQFN-16-1EP_4x4mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
