(module QFN-16-1EP_4x4mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77)
  (descr "16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.65")
  (attr smd)
  (fp_text reference REF** (at 0 -3.4) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value QFN-16-1EP_4x4mm_Pitch0.65mm (at 0 3.4) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2.65 -2.65) (end -2.65 2.65) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.65 -2.65) (end 2.65 2.65) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.65 -2.65) (end 2.65 -2.65) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.65 2.65) (end 2.65 2.65) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.15 -2.15) (end 2.15 -1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 2.15) (end -2.15 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 2.15) (end 2.15 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 -2.15) (end -1.375 -2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 2.15) (end -1.375 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 2.15) (end 1.375 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 -2.15) (end 1.375 -2.15) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2 -0.975) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2 -0.325) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2 0.325) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2 0.975) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -0.975 2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -0.325 2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 0.325 2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 0.975 2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 2 0.975) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 2 0.325) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 2 -0.325) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 2 -0.975) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 0.975 -2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 0.325 -2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at -0.325 -2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at -0.975 -2 90) (size 0.8 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 0.625 0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at 0.625 -0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at -0.625 0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at -0.625 -0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/QFN-16-1EP_4x4mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
