(module DFN-8-1EP_4x4mm_Pitch0.8mm (layer F.Cu) (tedit 54130A77)
  (descr "8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "DFN 0.8")
  (attr smd)
  (fp_text reference REF** (at 0 -3.075) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value DFN-8-1EP_4x4mm_Pitch0.8mm (at 0 3.075) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2.65 -2.35) (end -2.65 2.35) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.65 -2.35) (end 2.65 2.35) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.65 -2.35) (end 2.65 -2.35) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.65 2.35) (end 2.65 2.35) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.625 2.15) (end 1.625 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.45 -2.15) (end 1.625 -2.15) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2 -1.2) (size 0.75 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2 -0.4) (size 0.75 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2 0.4) (size 0.75 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2 1.2) (size 0.75 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 2 1.2) (size 0.75 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2 0.4) (size 0.75 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2 -0.4) (size 0.75 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2 -1.2) (size 0.75 0.35) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0.625 1.35) (size 1.25 0.9) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at 0.625 0.45) (size 1.25 0.9) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at 0.625 -0.45) (size 1.25 0.9) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at 0.625 -1.35) (size 1.25 0.9) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.625 1.35) (size 1.25 0.9) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.625 0.45) (size 1.25 0.9) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.625 -0.45) (size 1.25 0.9) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.625 -1.35) (size 1.25 0.9) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/DFN-8-1EP_4x4mm_Pitch0.8mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
