(module UQFN-16-1EP_3x3mm_Pitch0.5mm (layer F.Cu) (tedit 54130A77)
  (descr "16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 -2.9) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value UQFN-16-1EP_3x3mm_Pitch0.5mm (at 0 2.9) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2.15 -2.15) (end -2.15 2.15) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.15 -2.15) (end 2.15 2.15) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.15 -2.15) (end 2.15 -2.15) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.15 2.15) (end 2.15 2.15) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.65 -1.65) (end 1.65 -1.125) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.65 1.65) (end -1.65 1.125) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.65 1.65) (end 1.65 1.125) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.65 -1.65) (end -1.125 -1.65) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.65 1.65) (end -1.125 1.65) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.65 1.65) (end 1.125 1.65) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.65 -1.65) (end 1.125 -1.65) (layer F.SilkS) (width 0.15))
  (pad 1 smd oval (at -1.5 -0.75) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd oval (at -1.5 -0.25) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd oval (at -1.5 0.25) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd oval (at -1.5 0.75) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd oval (at -0.75 1.5 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd oval (at -0.25 1.5 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd oval (at 0.25 1.5 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd oval (at 0.75 1.5 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd oval (at 1.5 0.75) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd oval (at 1.5 0.25) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd oval (at 1.5 -0.25) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd oval (at 1.5 -0.75) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd oval (at 0.75 -1.5 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd oval (at 0.25 -1.5 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd oval (at -0.25 -1.5 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd oval (at -0.75 -1.5 90) (size 0.8 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 0.4375 0.4375) (size 0.875 0.875) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at 0.4375 -0.4375) (size 0.875 0.875) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at -0.4375 0.4375) (size 0.875 0.875) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 17 smd rect (at -0.4375 -0.4375) (size 0.875 0.875) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/UQFN-16-1EP_3x3mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
