(module MSOP-10-1EP_3x3mm_Pitch0.5mm (layer F.Cu) (tedit 54130A77)
  (descr "MSE Package; 10-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081664_I_MSE.pdf)")
  (tags "SSOP 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value MSOP-10-1EP_3x3mm_Pitch0.5mm (at 0 2.55) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2.8 -1.8) (end -2.8 1.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.8 -1.8) (end 2.8 1.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.8 -1.8) (end 2.8 -1.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.8 1.8) (end 2.8 1.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.625 -1.625) (end -1.625 -1.3775) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.625 -1.625) (end 1.625 -1.3775) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.625 1.625) (end 1.625 1.3775) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 1.625) (end -1.625 1.3775) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 -1.3775) (end -2.55 -1.3775) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2.105 -1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.105 -0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.105 0) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.105 0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.105 1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.105 1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.105 0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.105 0) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 2.105 -0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 2.105 -1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 11 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 11 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 11 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_SSOP.3dshapes/MSOP-10-1EP_3x3mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
